TSMC has completed its 5 nm design infrastructure for future Apple chipsets

10 April 2019, 03:41:52

TSMC has completed its 5 nm design infrastructure for future Apple chipsetsTSMC has announced the delivery of the complete version of its 5 nm design infrastructure within the Open Innovation Platform (OIP). It will sit at the base of 5nm systems-on-chip designs for mobile devices targeting 5G and AI. TSMC's 5nm process is already in risk production and includes the full versions of the 5nm Design Rule Manual (DRM), SPICE model, process design kits (PDKs) and silicon-validated foundation and interface IP, and also supports a full range of certified EDA tools and design flows. TSMC plans on investing around $25 billion for volume production by 2020.

"TSMC's 5-nanometer technology offers our customers the industry’s most advanced logic process to address the exponentially growing demand for computing power driven by AI and 5G," said Cliff Hou, Vice President of Research & Development/Technology Development at TSMC. "5-nanometer technology requires deeper design-technology co-optimization. Therefore, we collaborate seamlessly with our ecosystem partners to ensure we deliver silicon-validated IP blocks and EDA tools ready for customer use. As always, we are committed to helping customers achieve first-time silicon success and faster time-to-market."

Being Apple's only chipset supplier for iPhones since 2016, TSMC is expected to supply its solutions for next-gen iPhones as well. The 5 nm process will be probably at the core of the 2020 iPhones.Nachrichtenquelle

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