Dimensions: 83.5 x 167.1 x 8.95 mm
Weight: 204 g
SoC: Qualcomm Snapdragon 820 MSM8996
CPU: 2x 2.15 GHz Kryo, 2x 1.6 GHz Kryo, Cores: 4
GPU: Qualcomm Adreno 530, 624 MHz
RAM: 4 GB, 1866 MHz
Storage: 32 GB, 64 GB, 128 GB
Display: 6.33 in, LCD, 1440 x 2560 pixels, 24 bit
Battery: 3400 mAh, Li-Polymer
OS: Android 6.0.1 Marshmallow
Camera: 5344 x 4016 pixels, 3840 x 2160 pixels, 30 fps
Dimensions: 74.2 x 151.1 x 7.5 mm
Weight: 169 g
SoC: MediaTek Helio X10 (MT6795)
CPU: ARM Cortex-A53, 2200 MHz, Cores: 8
GPU: PowerVR G6200, 700 MHz
RAM: 3 GB, 933 MHz
Storage: 16 GB, 32 GB
Display: 5.5 in, IPS, 1080 x 1920 pixels, 24 bit
Battery: 3000 mAh, Li-Polymer
OS: Android 5.0.2 Lollipop
Camera: 4160 x 3120 pixels, 3840 x 2160 pixels, 30 fps
Dimensions: 83.5 x 167.1 x 8.95 mm
Weight: 204 g
SoC: Qualcomm Snapdragon 810 MSM8994
CPU: 4x 2.0 GHz ARM Cortex-A57, 4x 1.5 GHz ARM Cortex-A53, Cores: 8
GPU: Qualcomm Adreno 430, 650 MHz
RAM: 4 GB, 1600 MHz
Storage: 32 GB, 64 GB, 128 GB
Display: 6.33 in, IPS, 2560 x 1440 pixels, 24 bit
Battery: 3400 mAh, Li-Polymer
OS: Android 5.0 Lollipop
Camera: 5344 x 4016 pixels, 3840 x 2160 pixels, 30 fps
Dimensions: 73.8 x 148.4 x 9.4 mm
Weight: 177 g
SoC: Qualcomm Snapdragon 810 MSM8994
CPU: 4x 2.0 GHz ARM Cortex-A57, 4x 1.5 GHz ARM Cortex-A53, Cores: 8
GPU: Qualcomm Adreno 430, 650 MHz
RAM: 4 GB, 1600 MHz
Storage: 32 GB, 64 GB
Display: 5.5 in, IPS, 1440 x 2560 pixels, 24 bit
Battery: 3000 mAh, Li-Polymer
OS: Android 5.0 Lollipop
Camera: 4208 x 3120 pixels, 3840 x 2160 pixels, 30 fps
Dimensions: 74.2 x 147.8 x 9.5 mm
Weight: 170 g
SoC: MediaTek Helio X10 (MT6795)
CPU: ARM Cortex-A53, 2000 MHz, Cores: 8
GPU: PowerVR G6200, 700 MHz
RAM: 3 GB, 933 MHz
Storage: 16 GB, 32 GB, 64 GB
Display: 5.5 in, IPS, 1080 x 1920 pixels, 24 bit
Battery: 3000 mAh, Li-Polymer
OS: Android 5.0 Lollipop
Camera: 4160 x 3120 pixels, 3840 x 2160 pixels, 30 fps
In an official press release LeTV Le Max Pro confirms it is the first commercially available smartphone to be equipped with the most powerful Qualcomm chipset to date - the Snapdragon 820. The new 64-bit custom-made, 2.2GHz quad-core Kryo CPU is made after the next-generation LPP 14nm process. It is coupled with an ADreno 530 GPU. The SoC has an integrated X12 LTE modem and a Hexagon 680 DSP. The LeTV Le Max Pro is...
6 January 2016
LeTV Le 1s has been officially presented today. The smartphone features a metal frame and body plus extremely thin bezels, which create an overall sleek and elegant look and feel. Its performance is based on a MediaTek Helio X10 (MT6795T) chipset, which includes a 2.2GHz CPU (the original CPU's clock rate is 2GHz) and a PowerVR G6200 GPU. There are also 3GB of RAM and 32GB of internal memory on board. The display...
27 October 2015
LeTV is a start-up smartphone manufacturer that targets the high-end market with its very first devices. Today it launched the LeTV S1 and two variants - the LeTV S1 Pro and the LeTV S1 Max, all three with almost non-existent bezels. The basic model is priced at CNY 1499 (USD 241) for its 16GB version, CNY 1599 (USD 257) for its 32GB version and CNY 1799 (USD 289) for the 64GB version. It features a 5.5-inch 1080p...
14 April 2015
