Samsung is ready with its 5 nm EUV process development

16 April 2019, 08:03:30

Samsung is ready with its 5 nm EUV process developmentToday, Samsung Electronics has announced that it has completed the development of its 5nm FinFET process technology and it is ready for customers' samples. The new production node provides up to a 25% increase in logic area efficiency with 20% lower power consumption or 10% higher performance compared to the 7 nm process. It uses extreme ultraviolet lithography in metal layer patterning. The 5 nm production node inherits all the 7nm intellectual property (IP), which means that migrating to 5 nm will be cheap, reliable and easy.

In October 2018, Samsung announced that the 7nm process and earlier this year it has already entered mass production. In addition, Samsung is working together with customers on the customized 6 nm EUV-based process node and has already received the product tape-out of this chip. Currently, the production happens at the S3-line in Hwaseong, Korea. Samsung will expand its EUV capacity to a new EUV line in Hwaseong, which is expected to be completed within the second half of 2019 and start production ramp-up from next year.

"In successful completion of our 5nm development, we’ve proven our capabilities in EUV-based nodes," said Charlie Bae, Executive Vice President of Foundry Business at Samsung Electronics. "In response to customers' surging demand for advanced process technologies to differentiate their next-generation products, we continue our commitment to accelerating the volume production of EUV-based technologies."

Mr. Bae continued, "Considering the various benefits including PPA and IP, Samsung's EUV-based advanced nodes are expected to be in high demand for new and innovative applications such as 5G, artificial intelligence (AI), high performance computing (HPC), and automotive. Leveraging our robust technology competitiveness including our leadership in EUV lithography, Samsung will continue to deliver the most advanced technologies and solutions to customers."Source

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Specifications

Full specifications of various moblie devices grouped by brand and year of announcement

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