REDMAGIC 11 Air launches with active cooling, transparent design, and next-gen performance
20 Януари 2026, 16:13:24
Add DeviceSpecifications as a preferred source on GoogleREDMAGIC has officially unveiled the REDMAGIC 11 Air, the second entry in its lightweight "Air" lineup and the long‑awaited answer to users who wanted an ultra‑thin gaming phone without sacrificing the brand's signature active cooling and transparent aesthetic. The new model brings back the fan, introduces a redesigned transparent back, and delivers performance that challenges even newer Snapdragon 8 Elite Gen 5 devices.
The REDMAGIC 11 Air continues the brand's tradition of transparent back panels, but this generation adopts a more structured, futuristic design language. The dual rear cameras, cooling fan, and flash module are arranged neatly in the upper left corner, separated by different textures that guide the eye toward the main camera and the fan.
On the upper right, the iconic REDMAGIC logo is paired with RGB lighting, balancing the visual weight of the back panel. Two racetrack‑inspired lines extend downward from the logo, evoking both speed and the look of internal ribbon cables, reinforcing the phone's tech‑centric identity. The 3D micro-isolated glass back features softened edges, and combined with the 7.85 mm thickness, the device offers a noticeably improved in‑hand feel.
The metal frame uses a matte finish with refined chamfers, and all buttons and vents follow a rectangular design consistent with the rest of the REDMAGIC 11 series. The active cooling system adopts an L‑shaped airflow path, drawing air from an opening above the fan and expelling it from the side. Internally, the fan sits close to the SoC's primary heat zone, working with the new, super-thick vapor chamber to rapidly dissipate heat.
On the front, the REDMAGIC 11 Air retains the brand's signature no‑punch‑hole display with upgraded specs compared to the 10 Air. The 6.85‑inch panel reaches a 95.1% screen‑to‑body ratio with ultra‑thin 1.25 mm bezels. It offers a 1.5K resolution, 144 Hz refresh rate, up to 2000 Hz touch sampling, and 1800‑nit peak brightness, delivering strong overall display performance. The REDMAGIC 11 Air features a 50MP main camera with OIS, an 8MP ultra-wide lens, and the brand's signature 16MP under-display camera.
Powered by the Snapdragon 8 Elite chipset, paired with LPDDR5X memory and UFS 4.1 storage, the REDMAGIC 11 Air also integrates the REDMAGIC‑developed Red Core R4 gaming chip. While the processor isn't Qualcomm's newest, REDMAGIC's aggressive tuning and active cooling allow the device to outperform many phones using the same platform.
Thermals remain well‑controlled thanks to the new active cooling fan with 24000 RPM. The redesigned dual‑sided convex vapor chamber, supported by aerospace‑grade aluminum, shortens the heat path and improves dissipation efficiency. The phone also includes a built‑in PC game emulator, allowing users to run classic and modern PC titles. Despite its slim profile, the REDMAGIC 11 Air houses a 7000 mAh battery with 120W fast charging support.
As the second model in the Air series, the REDMAGIC 11 Air represents a more mature and user‑aligned interpretation of the lightweight gaming phone concept. The return of the active cooling fan, combined with the Snapdragon 8 Elite and RedMagic’s tuning, gives the device performance that rivals newer flagship chips. The redesigned transparent back, refined build quality, and excellent battery life further strengthen its appeal.
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