Comparison between:
- Xiaomi Mi 10 Ultra
- Infinix GT 20 Pro

Brand and model

Information about the brand, model and model alias (if any) of a specific device.

Xiaomi Mi 10 UltraInfinix GT 20 Pro
Xiaomi Mi 10 UltraInfinix GT 20 Pro
Model aliasMi 10 Extreme Edition
M2007J1SC
X6871

Design

Information about the dimensions and weight of the device, shown in different measurement units. Body materials, available colors, certifications.

Width75.04 mm
7.504 cm
0.246 ft
2.954 in
75.43 mm
7.543 cm
0.247 ft
2.97 in
Height162.38 mm
16.238 cm
0.533 ft
6.393 in
164.26 mm
16.426 cm
0.539 ft
6.467 in
Thickness9.45 mm
0.945 cm
0.031 ft
0.372 in
8.15 mm
0.815 cm
0.027 ft
0.321 in
Weight221 g
0.49 lbs
7.82 oz
194 g
0.43 lbs
6.84 oz
Volume115.15 cm³
6.99 in³
100.98 cm³
6.13 in³
ColorsObsidian Black
Mercury Silver
Transparent Edition
Mecha Blue
Mecha Orange
Mecha Silver
Body materialsCeramic
Glass
Plastic
Glass
Aluminium alloy
Certification-IP54

SIM card

The Subscriber Identity Module (SIM) is used in mobile devices for storing data authenticating the subscribers of mobile services.

SIM card typeNano-SIM
Nano-SIM / microSD
Nano-SIM
Number of SIM cards22
FeaturesDual SIM stand-by (Both cards are active. When one is busy, the other is not active)Dual SIM stand-by (Both cards are active. When one is busy, the other is not active)

Networks

A mobile (cellular) network is a radio system, which allows a large number of mobile devices to communicate with each other.

GSMGSМ 850 МНz (В5)
GSМ 900 МНz (В8)
GSМ 1900 МНz (В2)
GSМ 850 МНz (В5)
GSМ 900 МНz (В8)
GSМ 1900 МНz (В2)
UMTSUМТS 900 МНz (В8)
UМТS 1700 МНz (В4)
UМТS 1900 МНz (В2)
UМТS 2100 МНz (В1)
UМТS 900 МНz (В8)
UМТS 1700 МНz (В4)
UМТS 1900 МНz (В2)
UМТS 2100 МНz (В1)
LTELТЕ-FDD 700 МНz (В12)
LТЕ-FDD 700 МНz (В17)
LТЕ-FDD 800 МНz (В20)
LТЕ-FDD 850 МНz (В5)
LТЕ-FDD 900 МНz (В8)
LТЕ-FDD 1700 МНz (В4)
LТЕ-FDD 1800 МНz (В3)
LТЕ-FDD 1900 МНz (В2)
LТЕ-FDD 2100 МНz (В1)
LТЕ-FDD 2600 МНz (В7)
LТЕ-ТDD 1900 МНz (В39)
LТЕ-ТDD 2000 МНz (В34)
LТЕ-ТDD 2300 МНz (В40)
LТЕ-ТDD 2600 МНz (В38)
LТЕ-FDD 700 МНz (В12)
LТЕ-FDD 700 МНz (В17)
LТЕ-FDD 700 МНz (В28)
LТЕ-FDD 800 МНz (В20)
LТЕ-FDD 850 МНz (В5)
LТЕ-FDD 900 МНz (В8)
LТЕ-FDD 1700 МНz (В4)
LТЕ-FDD 1700 МНz (В66)
LТЕ-FDD 1800 МНz (В3)
LТЕ-FDD 1900 МНz (В2)
LТЕ-FDD 2100 МНz (В1)
LТЕ-FDD 2600 МНz (В7)
LТЕ-ТDD 2300 МНz (В40)
LТЕ-ТDD 2600 МНz (В38)
5G NR5G-FDD 1800 MHz (n3)
5G-FDD 2100 MHz (n1)
5G-TDD 2500 MHz (n41)
5G-TDD 3500 MHz (n78)
5G-TDD 4700 MHz (n79)
5G-FDD 700 MHz (n12)
5G-FDD 700 MHz (n28)
5G-FDD 800 MHz (n20)
5G-FDD 850 MHz (n5)
5G-FDD 900 MHz (n8)
5G-FDD 1700 MHz (n66)
5G-FDD 1800 MHz (n3)
5G-FDD 2100 MHz (n1)
5G-TDD 2300 MHz (n40)
5G-TDD 2500 MHz (n41)
5G-FDD 2600 MHz (n7)
5G-TDD 2600 MHz (n38)
5G-TDD 3500 MHz (n78)
5G-TDD 3700 MHz (n77)

Mobile network technologies and bandwidth

Communication between devices within mobile networks is realized via various generations of network technologies, which provide different bandwidth.

Mobile network technologiesUМТS
GРRS
LТЕ Саt 20
UМТS
GРRS
LТЕ
Snapdragon X55 modem
HPUE
HO R&D
-

Operating system

Operating system is the system software, which manages and controls the functioning of the hardware components of the device.

Operating system (OS)Аndrоid 10ХОS 14 fоr GТ (Аndrоid 14)
User interface (UI)MIUI 12-

System on Chip (SoC)

A system on a chip (SoC) includes into a single chip some of the main hardware components of the mobile device.

SoCQuаlсоmm Snарdrаgоn 865 (SМ8250)МеdiаТеk Dimеnsity 8200-Ultrа (МТ6896ΖВ)
Process technology7 nm4 nm
CPU1х 2.84 GНz АRМ Соrtех-А77, 3х 2.42 GНz АRМ Соrtех-А77, 4х 1.8 GНz АRМ Соrtех-А55 (Κryо 585)1х 3.1 GНz АRМ Соrtех-А78, 3х 3.0 АRМ Соrtех-А78, 4х 2.0 АRМ Соrtех-А55
CPU bits64 bit64 bit
Instruction setARMv8.2-AARMv8.2-A
Level 1 cache memory (L1)16 KB + 16 KB16 KB + 16 KB
Level 2 cache memory (L2)1792 KB
1.75 MB
-
Level 3 cache memory (L3)4096 KB
4 MB
-
CPU cores88
CPU frequency2840 MHz3100 MHz
GPUQualcomm Adreno 650ARM Mali-G610 MC6
GPU cores-6
GPU frequency587 MHz950 MHz
RAM capacity8 GB
12 GB
16 GB
8 GB
12 GB
RAM typeLPDDR5LPDDR5X
RAM channelsQuad channelQuad channel
RAM frequency2650 MHz3100 MHz
5th Gen AI Engine
Game Turbo 4.0
LiquidCool 2.0 Vapor Chamber
6-stack graphite layer
Graphene layer
Virtual RAM expansion
Cooling system with Phase Change Material (PCM)

Storage

Every mobile device has a built-in storage (internal memory) with a fixed capacity.

Storage128 GB
256 GB
512 GB
256 GB
UFS 2.0UFS 2.0

Display

The display of a mobile device is characterized by its technology, resolution, pixel density, diagonal length, color depth, etc.

Type/technologyAMOLEDAMOLED
Diagonal size6.67 in
169.42 mm
16.94 cm
6.78 in
172.21 mm
17.22 cm
Width2.74 in
69.52 mm
6.95 cm
2.9 in
73.72 mm
7.37 cm
Height6.08 in
154.5 mm
15.45 cm
6.13 in
155.63 mm
15.56 cm
Aspect ratio2.222:12.111:1
Resolution1080 x 2400 pixels720 x 1520 pixels
Pixel density395 ppi
155 ppcm
248 ppi
97 ppcm
Color depth30 bit
1073741824 colors
30 bit
1073741824 colors
Display area88.43 %92.9 %
Other featuresCapacitive
Multi-touch
Scratch resistant
Capacitive
Multi-touch
Scratch resistant
3D curved glass screen
Corning Gorilla Glass 5
Display manufacturer - CSOT (TCL)
5M:1 dynamic contrast ratio
Typical brightness - 800 cd/m²
Peak brightness - 1120 cd/m²
120Hz refresh rate
240Hz touch sampling rate
100% DCI-P3
TÜV Rheinland Low Blue Light Certification
JNCD <0.63
Delta-E <1
2.5D curved glass screen
144 Hz refresh rate
360 Hz touch sampling rate
2304 Hz PWM dimming
1300 cd/m² peak brightness
100% DCI-P3
Pixelworks Chips
MEMC (Motion Estimation Motion Compensation)

Sensors

Different sensors measure different physical quantities and convert them into signals recognizable by the mobile device.

SensorsProximity
Light
Accelerometer
Compass
Gyroscope
Barometer
Geomagnetic
Fingerprint
Hall
Proximity
Light
Accelerometer
Compass
Gyroscope
In-display fingerprint sensor
Ultrasonic proximity sensor
Under-display ambient light sensor
In-display fingerprint sensor
X-axis linear motor

Main rear camera

The main camera of the mobile device is usually placed on its back and can be combined with one or more additional cameras.

Sensor modelOmniVision OV48CSamsung S5KHM6
Sensor typePureCelISOCELL
Sensor format1/1.32"-
Pixel size1.2 µm
0.001200 mm
0.64 µm
0.000640 mm
Aperturef/1.85f/1.75
Field of view-83.63 °
Number of lenses86
Flash typeTriple LEDQuad LED
Image resolution8000 x 6000 pixels
48 MP
12000 x 9000 pixels
108 MP
Video resolution7680 x 4320 pixels
33.18 MP
3840 x 2160 pixels
8.29 MP
Video FPS24 fps60 fps
FeaturesAutofocus
Continuous autofocus
Digital zoom
Optical zoom
Digital image stabilization
Optical image stabilization
Geotagging
Panorama
HDR
Touch focus
Face detection
Face unlock
White balance settings
ISO settings
Exposure compensation
Self-timer
Scene mode
Phase detection autofocus (PDAF)
Laser autofocus (LAF)
AI 2.0
Night Mode 2.0
Autofocus
Continuous shooting
Digital zoom
Digital image stabilization
Optical image stabilization
Geotagging
Panorama
HDR
Touch focus
Face detection
White balance settings
ISO settings
Exposure compensation
Self-timer
Scene mode
Macro mode
Phase detection autofocus (PDAF)
Laser autofocus (LAF)
Pixel size - 2.4 μm (4-in-1 pixel binning)
PureCel Plus stacked die technology
4C Half Shield Phase Detection AF
Dual Native ISO technology
-

Ultra-wide camera

Specifications of the ultra-wide camera of the device. This type of camera captures a wider field of view compared to the main camera.

Focal length equivalent (35 mm)12 mm *(35 mm / full frame)-
Field of view128 °-
Number of lenses7-
Image resolution20 MP-
2.5 cm shooting distance for macro-

Telephoto camera

Specifications of the telephoto camera. These cameras are used to capture distant objects by using optical zoom to make them look closer without losing resolution and detail.

Pixel size1.6 µm
0.001600 mm
-
Number of lenses5-
Optical zoom5 x-
Image resolution48 MP-
120x digital zoom
Second telephoto camera - 12 MP
Pixel size - 1.4 μm (#2)
6-element lens (#2)
PDAF (#2)
2x optical zoom (#2)
-

Macro camera

Specifications of the macro camera of the device. This type of camera in smartphones is used to snap close-up photos of tiny objects.

Aperture-f/2.4
Image resolution-2 MP

Depth-sensing camera

Specifications of the depth sensor of the device. Depth sensors measure the distance between the subject and the camera, enabling features such as bokeh in portraits.

Aperture-f/2.4
Image resolution-2 MP

Front camera

Modern smartphones have one or more front cameras and their positioning has led to various design concepts – pop-up camera, rotating camera, notch, punch hole, under-display camera, etc.

Sensor modelSamsung S5K3T2-
Sensor typeISOCELLCMOS BSI
Sensor format1/3.4"-
Pixel size0.8 µm
0.000800 mm
-
Aperturef/2.2f/2.2
Field of view80 °88.9 °
Number of lenses-5
Auxiliary light-Dual LED
Image resolution5440 x 3697 pixels
20.11 MP
6816 x 4743 pixels
32.33 MP
Video resolution1920 x 1080 pixels
2.07 MP
2560 x 1440 pixels
3.69 MP
Video FPS30 fps30 fps
FeaturesHDR
Face unlock
Face unlock
Face detection
Angle of view - 117°-

Audio

Information about the type of speakers and the audio technologies supported by the device.

SpeakerLoudspeaker
Earpiece
Stereo speakers
Loudspeaker
Earpiece
Stereo speakers
AI Noise Reduction
Smart PA
Hi-Res Audio
Sound by JBL
Hi-Res Audio
DTS

Radio

The radio in a mobile device is a built-in FM radio receiver.

RadioYesYes

Tracking/Positioning

Information about the positioning and navigation technologies supported by the device.

Tracking/PositioningGРS
А-GРS
GРS
А-GРS

Wi-Fi

Wi-Fi is a technology that provides wireless data connections between various devices within a short range.

Wi-Fi802.11а
802.11b
802.11g
Wi-Fi 6 (802.11ах)
Wi-Fi Disрlаy
802.11а
802.11аd
802.11а
802.11b
802.11g
Wi-Fi 6 (802.11ах)
Wi-Fi Disрlаy
802.11а
802.11аd
8x8 MU-MiMO-

Bluetooth

Bluetooth is a standard for secure wireless data transfer between different types of devices over short distances.

Version5.15.2
FeaturesA2DP
AVRCP
DIP
HFP
HID
HSP
LE
MAP
OPP
PAN
PBAP
A2DP
EDR
LE

USB

The Universal Serial Bus (USB) is an industry standard that allows different electronic devices to exchange data.

Connector typeMicro USBMicro USB
Version-2.0
FeaturesCharging
Mass storage
On-The-Go
Charging
Mass storage
On-The-Go

Headphone jack

The headphone jack is an audio phone connector, a.k.a. an audio jack. The most widely used one in mobile devices is the 3.5 mm headphone jack.

Headphone jackNoNo

Connectivity

Information about other important connectivity technologies supported by the devices.

ConnectivityComputer sync
OTA sync
Infrared
Tethering
NFC
ANT+
Computer sync
OTA sync
Infrared
Tethering
NFC
VoLTE

Browser

A web browser is a software application for accessing, fetching, displaying and navigating through information on the World Wide Web.

BrowserHTML
HTML5
CSS 3
HTML
HTML5
CSS 3

Audio file formats/codecs

Mobile devices support various audio file formats and codecs, which respectively store and code/decode digital audio data.

Audio file formats/codecsAAC
AAC+
AMR
AMR-WB
aptX
aptX HD
eAAC+
FLAC
MP3
WAV
LDAC
LHDC
aptX-Adaptive
PCM
AMR-NB
AAC
AAC+
AMR
AMR-WB
aptX
eAAC+
FLAC
MIDI
MP3
OGG
WMA
WAV

Video file formats/codecs

Mobile devices support various video file formats and codecs, which respectively store and code/decode digital video data.

Video file formats/codecsMP4
M4V
MKV< WMV
WEBM
3GP
3G2
ASF
3GPP
AVI
DivX
H.263
H.264
H.265
MP4
VP8
VP9
WebM
WMV
Xvid

Battery

The batteries of mobile devices differ in capacity and technology. They provide the electrical charge needed for the functioning of the devices.

Capacity4500 mAh5000 mAh
TypeLi-PolymerLi-Polymer
Charger output power5 V / 3 A
3 V / 11 A
6 V / 20 A
9 V / 5 A
FeaturesWireless charging
Fast charging
Non-removable
Fast charging
Non-removable
Dual Cell battery
120W fast charging
50W wireless charging
10W reverse wireless charging
TÜV Rheinland 3.0 certification for fast charging
-
 Xiaomi Mi 10 UltraInfinix GT 20 Pro

Last viewed devices

List of mobile devices, whose specifications have been recently viewed.

Xiaomi Mi 3 TD

Xiaomi Mi 3 TD

Dimensions: 73.6 x 144 x 8.1 mm
Weight: 145 g
SoC: Nvidia Tegra 4 AP40
CPU: 4x ARM Cortex-A15, 1x ARM Cortex-A9, 1800 MHz, Cores: 5
GPU: GeForce, 672 MHz
RAM: 2 GB, 933 MHz
Storage: 16 GB, 64 GB
Display: 5 in, IPS, 1080 x 1920 pixels, 24 bit
Battery: 3050 mAh, Li-Ion
OS: Android 4.2.2 Jelly Bean
Camera: 4208 x 2368 pixels, 1920 x 1080 pixels, 30 fps

Huawei Ascend Mate7

Huawei Ascend Mate7

Dimensions: 81 x 157 x 7.9 mm
Weight: 185 g
SoC: Huawei HiSilicon KIRIN 925
CPU: 4x 1.8 GHz ARM Cortex-A15, 4x 1.3 GHz ARM Cortex-A7, Cores: 8
GPU: ARM Mali-T628 MP4, 600 MHz
RAM: 2 GB, 3 GB, 800 MHz
Storage: 16 GB, 32 GB
Display: 6 in, IPS, 1080 x 1920 pixels, 24 bit
Battery: 4100 mAh, Li-Polymer
OS: Android 4.4.2 KitKat
Camera: 4160 x 3120 pixels, 1920 x 1080 pixels, 30 fps

Xiaomi Mi 2a

Xiaomi Mi 2a

Dimensions: 66.5 x 133 x 9.5 mm
Weight: 133 g
SoC: Qualcomm Snapdragon S4 Pro (MSM8260A Pro)
CPU: 2x 1.7 GHz Krait 300, Cores: 2
GPU: Qualcomm Adreno 320, 400 MHz
RAM: 1 GB, 500 MHz
Storage: 16 GB
Display: 4.5 in, IPS, 720 x 1280 pixels, 24 bit
Battery: 2030 mAh, Li-Ion
OS: MIUI V5 (Android 4.1.1 Jelly Bean)
Camera: 3264 x 2448 pixels, 1920 x 1080 pixels, 30 fps

Huawei Ascend P7

Huawei Ascend P7

Dimensions: 68.8 x 139.8 x 6.5 mm
Weight: 124 g
SoC: Huawei HiSilicon KIRIN 910T
CPU: 4x 1.8 GHz ARM Cortex-A9, Cores: 4
GPU: ARM Mali-450 MP4
RAM: 2 GB
Storage: 16 GB
Display: 5 in, LCD, 1080 x 1920 pixels, 24 bit
Battery: 2500 mAh, Li-Polymer
OS: Android 4.4.2 KitKat
Camera: 4160 x 3120 pixels, 1920 x 1080 pixels, 30 fps

Xiaomi Mi 2

Xiaomi Mi 2

Dimensions: 62 x 126 x 10.2 mm
Weight: 145 g
SoC: Qualcomm Snapdragon S4 Pro (APQ8064)
CPU: 4x 1.5 GHz Krait 200, Cores: 4
GPU: Qualcomm Adreno 320, 400 MHz
RAM: 2 GB, 533 MHz
Storage: 16 GB, 32 GB
Display: 4.3 in, IPS, 720 x 1280 pixels, 24 bit
Battery: 2000 mAh, Li-Ion
OS: Android 4.1.1 Jelly Bean
Camera: 3264 x 2448 pixels, 1920 x 1080 pixels, 30 fps